The CyberOptics® LSM allows your company to start monitoring your printing process within hours of receiving it. Operators are easily trained to take paste height and width measurements on various types of solder pads. This system utilizes a single laser stripe and triangulation technology to calculate the measurements.
Small Initial Investment = Fast ROI
Height and Width Measurements
Minimal Operator Training Required
1991 - 1997
.: CyberOptics® LSM 300 Auto (Off-line Inspection) :.
The LSM300 follows thesuccessful Laser section Microscopes LSM and LSM2. This new non-contact laser based system is an off-Line solder paste inspection system. LSM300 provides automatic height measurements, eliminating the inconsistencies of manual measurements and substantially improving repeatability. Additional to the height measurement the LSM300 provides dimensional x- / y-measurements, as well as area- and volume data of various pad forms.
Due to the adjustable magnification level with variable measurement range and powerful software tools the LSM300 is useful for many SMT specific application. The most common usage is measuring the wet solder paste immediately after printing. Stencil apertures can also be measured. After reflow solder joints are easily examined.
Accurate and repeatable results, combined with various analysis and documentation possibilities, such as integrated SPC, make the LSM300 an effective and economical SMT-Inspection system.
CyberOptics® LSM 300
provides contract inspection
services to a wide variety of
industries, ranging from medical
to aerospace applications.
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