Sampled Solder Paste Inspection SE 200 provides an affordable alternative to expensive board scanning systems, offering the same benefits - repeatability and continuous process monitoring - at a fraction of the cost.
SE 200 calculates true volume based on 3D measurements, producing more precise, repeatable results than 2D systems.
Typically the SE 200 performs 100% 3D inspection of 13 x 13, 50 mil pitch BGA site in 8 seconds, 1005 inspection 0f 160-Lead, 20 mill pitch QFA site takes approximately 12 seconds.
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2000
Re-Conditioned w/warrantee
CyberOptics®
SE200
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